陶瓷PTCR化学镀铜电极溶液中络合剂的作用

Speciation in Electroless Copper Solutio ns for PTCR Ceramics and the Roles of Complexing Agents

通过热力学平衡的方法 ,研究了在 Ba Ti O3 系陶瓷 PTCR上进行化学沉积金属电极时常用的酒石酸盐-铜离子和乙二胺四乙酸钠盐 (EDTA) -铜离子体系化学镀铜溶液中各种型体铜离子的分布。实验表明 ,加入络合剂会影响化学镀铜的速度。文章研究的络合剂酒石酸盐和 EDTA会使化学镀铜速度明显下降 ,这可能是由于空间位阻的原因。通过研究表明 ,选择合适的络合剂对于化学镀铜的稳定操作 ,意义十分重大。

Based on thermo dynamic speciation calculations,the role s of complexing agents in electroless co pper solutions,employed in ohmic electro des formation of BaTiO 3-based PTCR cera mics,were investigated in this paper.Ele ctroless copper solutions,using tartrate or EDTA salt,decrease the concentration of free copper.All solutions exhibit a fraction of free copper,which decreased with increasing formation constant of th e copper-ligand species.The plating rate and solution stability are dependent up on the structure of copper in solution.H igher deposition rates were observed in copper solutions with fewer chelated sit es in the copper complex.