一种高密度系统封装的设计与制作

Design and Fabrication of High-Density System-in-Package

介绍了硅基内埋置有源芯片多层布线工艺、低温共烧陶瓷(LTCC)基板工艺、芯片叠层装配等高密度系统级封装技术,重点介绍了系统级封装技术的总体结构设计、主要工艺流程、三维层叠互连的关键工艺技术,以及系统测试和检测评价等技术。

Technologies for system-in-package（SIP）,including multilayer wiring process for Si-based embedded active chip,low temperature co-fired ceramic technique and stacked die packaging,were described.The overall structural design of SIP,the major process flow,and key techniques for three-dimensional interconnection of stacked dies were dealt with in particular,as well as techniques for system test,inspection and evaluation.