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钠钙玻璃微流管道的厚胶湿法腐蚀工艺优化

Optimization of Wet Etching of Thick Photoresist for Micro-Flow Pipeline on Soda-Lime Glass
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摘要 为了克服石英玻璃和Pyrex 7740玻璃制作微流管道价格昂贵、工艺流程复杂等缺点,利用普通钠钙玻璃为基质、正光刻胶AZ4620为掩膜牺牲层,提出了一种高效、快速、低成本的微流管道制作方法。该方法优化了腐蚀工艺的关键参数,解决了光刻胶与玻璃的粘附性、光刻胶在腐蚀液中的耐受时间等问题。试验腐蚀深度达到80μm,最小特征尺寸小于50μm,微流管道侧壁陡直度小于100°,底部平整度误差小于±1.5μm,制作周期仅需4h左右。 To overcome the disadvantages of high cost and complicated manufacturing process of micro-flow pipeline based on quartz glass or Pyrex 7740 glass,an efficient,rapid and low-cost micro-flow pipeline process was presented by using soda-lime glass as substrate carrier and positive photoresist AZ 4620 as sacrificial layer.In this technology,key parameters of etching process were optimized,and problems associated with adhesion of photoresist to glass and tolerance time of photoresist in etching solution were solved.With the optimized process,an etching depth of 80 μm,a minimum feature size less than 50 μm,a sidewall steepness less than 100°,and a bottom flatness error less than ± 1.5 μm were achieved,and the process cycle was only about 4 hours.
出处 《微电子学》 CAS CSCD 北大核心 2013年第2期282-286,共5页 Microelectronics
关键词 微细加工 钠钙玻璃 微流管道 紫外厚胶光刻 湿法腐蚀 Microfabrication Soda-lime glass Microflow pipeline UV lithography of thick photoresist Wet etching
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  • 1唐雄贵,郭永康,杜惊雷,刘世杰,高福华.基于角谱理论的厚层光刻胶衍射光场研究[J].光学学报,2004,24(12):1691-1696. 被引量:8
  • 2张晚云,季家榕,袁晓东,叶卫民,朱志宏.电化学制备P型硅基二维光子晶体优化参数[J].电化学,2005,11(4):377-381. 被引量:1
  • 3陈瑜,吴俊徐,郭平生,王连卫,M.van der Zwan,P.M.Sarro.一种用于硅基MEMS加工的深刻蚀技术[J].微细加工技术,2005(4):37-41. 被引量:6
  • 4王渭源,鲍敏杭.微电子机械系统进展和趋势[J].功能材料与器件学报,1996,2(3):129-136. 被引量:10
  • 5[1]MADOU M. Fundamentals of Mierofabrication 2nd [ M] . New York: CBC Press, 2001.
  • 6[2]ELWENSPOEK M, JANSEN H. Silicon Micromaching [M] .Cambridge University Press, 1998.
  • 7[3]CAMPBELL S A. The Science and Engineering of Microelectronic Fabrication, 2nd ed [ M] . London: Oxford University Press, 2001.
  • 8[4]NONOGAKI S, UENO T, ITO T. Microlithography Fundamentals in Semiconductor Devices and Fabrication Technology [M] . New York: Marcel Dekker, 1998.
  • 9[5]EHRFELD W, GOTZ F, MUNCHMEYER D, et al. LIGA process: Sensor construction techniques via X-ray lithography [A].Tech Digest of Solid-State Sensor and Acutor Workshop [M].Hilton Head, SC, 1998, 1-4.
  • 10[6]LI X B. High-aspect-ratio nickel eletroplating with 2 μm beamwidth for microswiteh application [M] . M.S thesis, UCLA, 1999.

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