异形结构电子设备热分析研究

Thermal Analysis of the Electronic Device with Special-shaped Structure

建模和网格划分一直是电子设备,尤其是异形结构电子设备热分析过程中的难题,迄今为止还未见有效的方法。文中根据导热和对流换热的基本规律,提出了异形结构电子设备热分析模型简化的方法,得出了异形结构电子设备热分析模型的重要参数。通过算例验证了文中所提出的异形结构电子设备热分析模型简化方法的合理性,并且通过试验验证了文中所进行的异形结构电子设备热分析的正确性和有效性。

Model building and grid division are always electronic device, especially the electronic device with difficult problems in the thermal analysis process of the special-shaped structure. No efficient method has been available up to now. According to the fundamental law in heat conduction and convection, the simplification method of the thermal analysis model of the electronic device with special-shaped structure is proposed and its important parameters are obtained in this paper. Finally, one example is given. The example and test show that the simplification method of the thermal analysis model in the paper is rational and efficient.