期刊文献+

混成式三维神经元微探针阵列的制备

Fabrication of Hybrid Three-Dimension Neural Probe Arrays
下载PDF
导出
摘要 提出了一种混成式三维神经元探针阵列结构和相应的制备流程。制备流程主要包括倒焊互连工艺和多刀片切割工艺,采用倒焊工艺将厚硅片直接倒焊到读出电路上,采用多刀片切割工艺直接将硅片切割成硅针阵列。该制备流程不包含高温工艺和硅腐蚀工艺,不损伤电路,实现了硅针阵列与电路直接集成。通过集成电路可以简化接口,降低引脚数量,制备的神经元探针阵列的规模可以不受引线口数量限制,可以覆盖一个完整的脑功能区。制作了规模为10×10的神经元探针阵列,探针的中心距为400μm。探针的底座高度为30μm,底座宽度为360μm,底座之间的空隙为40μm。探针宽度为100μm,高度为1 470μm。针尖的角度为25°。初步测试结果表明探针阵列是满足神经元信号探测。 Hybrid three-dimension neural probe array structure and the fabrication process were reported.Neural probe arrays were fabricated by using flip chip and multi-blade dicing techniques.High-temperature process and silicon wet etching process,which would damage the circuit,were not included in the entire fabrication process.Therefore,silicon probe arrays can be directly integrated on the circuit,thus simplifying the interface and reducing pad count.Furthermore,the scale of neural probe array wasn ' t limited by the number of pads,and can cover a whole brain function area.10×10 scale three-dimension neural probe arrays with the centre-to-centre separation of 400 μm were fabricated.The height of the probe base was 30 μm,the base width was 360 μm,and the gap between the bases was 40 μm.The width of the probe was 100 μm,the height was 1 470 μm,and the tip angle was 25°.Preliminary tests indicated that the probe arrays can meet neuron signal detection requirements.
出处 《传感技术学报》 CAS CSCD 北大核心 2013年第2期150-156,共7页 Chinese Journal of Sensors and Actuators
基金 国家自然科学基金项目(60906057) 中国科学院上海技术物理研究所创新专项自由探索项目(Q-ZY-86) 复旦大学专用集成电路与系统国家重点实验室开放课题项目(12KF002)
关键词 神经元探针阵列 混成式 三维 微机械加工 neural probe array hybrid three-dimension micro mechanical fabrication
  • 相关文献

参考文献14

  • 1John G Nicholls, A Robert Martin,B G Wallace,et al.神经生物学[M].杨雄里,译.北京:科学出版社,2003:14-22.
  • 2David A Robinson. The Electrical Properties of Metal Microelectrodes[J]. Proceedings of the IEEE,1968,56(6) :1065-1071.
  • 3Otto F Schanne, Marc Lavallee, Raynald Laprade, et al. ElectricalProperties of Glass Microelectrodes[ J]. Proceedings of the IEEE,1968,56(6) :1072-1082.
  • 4Miguel A L Nicolelis. Actions from Thoughts [ J]. Nature,2001,409(18) :403-407.
  • 5GySrgy Buzs6ki. Large-Scale Recording of Neuronal Ensembles[ J].Nature Neuroscience ,2004,7(5) :446-451.
  • 6Wise K D, Anderson D J, Hetke J F,et al. Wireless ImplantableMicrosystems: High-Density Electronic Interfaces to the NervousSystem[ J]. Proceedings of the IEEE,2004,92( 1) :76-97.
  • 7Kelly E Jones,Patrick K Campbell,Richard A Normann. A Glass/Silicon Composite Intracortical Electrode Array [ J]. Annals of Bi-ommedical Engineering,1992,20:423-437.
  • 8William R Patterson,Yoon-Kyu Song,Christopher W Bull,et. al. AMicroelectrode/Microelectronic Hybrid Device for BrainImplantable Neuroprosthesis Applications [ J]. IEEE Transactionson biomedical Engineering,2004,51( 10) : 1845-1853.
  • 9Yoon-Kyu Song, William R Patterson, Christopher W Bull, et al.Development of a Chipscale Integrated Microelectrode/ MicroelectronicDevice for Brain Implantable Neuroengineering Applications [ J]. IEEETransactions on Neural Systems and Rehabilitation Engineering,2005,13(2):220-226.
  • 10程正喜,黄维宁,周嘉,黄宜平,鲍敏杭.MEMS神经元微探针研究[J].传感技术学报,2006,19(05A):1388-1390. 被引量:3

二级参考文献17

  • 1Wise K D, et al. Wireless Implantable Microsystems: HighDensity Electronic Interfaces to the Nervous System. Proceeding of the IEEE. , January 2004, 92(1) :76-97.
  • 2Yao Y, et al. A Low-Profile Three-Dimensional Neural Stimulating Array with On-chip Current Generation, Proceeding of the 26th Annual International Conference of the IEEE EMBS,2004 : 1994-1997.
  • 3Papageorgiou D, et al. A Process-Compatible Passive Shutter for Buried-Channel Chemical Delivery Probes. Proceedings of the first joint BME/EMBS Conference Serving Humanity, Advancing Technology, 1999:835.
  • 4Dongming He, Theory, fabrication and characterization of micromachined electrolytic solution conductivity sensors, Ph.D.dissertation, University of Illinois at Urbana-Champaign,2001.
  • 5Dongming He, Mark A. Shannon, and Norman. IEEE sensors Journal, December 2005,5(6):1185-1196.
  • 6Khalil Najafi. Solid-State Microsensors for Cortical Nerve Recordings[J]. IEEE Engineering in Medicine and Biology,June/July 1994 : 375-387.
  • 7David A Robinson. The Electrical Properties of Metal Microelectrodesl[J]. Proceeding of the IEEE, June 1968, 56 (6):1065-1071.
  • 8Otto F. Schanne, Marc Lavallee. Raynald Lappade, et al.Proceedings of the IEEE, JUNE 1968, 56(6): 1072-1082.
  • 9Kensall D Wise, et al. A Low-Capacitance Multielectrode Probe for Use in Extracellular Neurophysiology. IEEE Transaction on Biomedical Engineering, May 1975, BME-22 (3)212-219.
  • 10Mikhail A. Lehedev , Miguel A. L. Nicolelis. Brain Machine Interfaces:Past, Present and Future [ J]. TRENDS in Neurosciences, 2006,29 (9) :536-546.

共引文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部