新型快速固化环氧树脂胶粘剂的制备及性能

Preparation and properties of new fast curable epoxy resin adhesive

以己二酸、多胺(如二乙烯三胺、三乙烯四胺或多乙烯多胺等)为原料,采用熔融缩聚法合成了3种低黏度、低毒性且可室温固化的环氧树脂(EP)胶粘剂用聚酰胺固化剂(PA1、PA2或PA3)。探讨了固化剂含量对EP胶粘剂的固化速率和粘接性能等影响,并采用单因素试验法优选出EP/固化剂的最佳配比。结果表明:EP胶粘剂的固化速率和剥离强度依次为EP/PA1胶粘剂>EP/PA2胶粘剂>EP/PA3胶粘剂;当m(PA1):m(EP)=0.6:1.0、w(促进剂)=1.0%(相对于EP质量而言)、固化温度为80℃和固化时间为60min时,相应胶粘剂的适用期较长,并且加热后能快速固化,而且用该胶粘剂制备的包封膜经处理后,其综合性能良好,可满足柔性印刷电路板(FPC)的生产要求。

With hexanedioic acid,polyamine（such as diethylene triamine,triethylene tetramine or polyethylene polyamine） as raw materials,three kinds of polyamide curing agents （PAl and PA2 or PA3） for epoxy resin（EP） adhesives ,which had some advantages （such as lower viscosity ,lower toxicity, and curable at room temperature）, were synthesized by melting polycondensation. The influences of curing agent contents on curing speed and bonding properties of EP adhesives were discussed,and the optimal proportion of EP/curing agent was preferred by single-factor experiment method. The results showed that the curing speeds and peeling strengths of EP adhesives were all EP/PA1 adhesive〉EP/PA2 adhesive〉EP/PA3 adhesive. The treated coating membrane,which was made by the adhesive,had good combination property,and could meet the production requirements of FPC （flexible printed circuit board） because the corresponding adhesive had longer working life,and fast curable after heating when mass ratio of m（PA1 ）：m（EP） was 0.6：1.0,mass fraction of accelerant was 1.0%,and curing temperature and curing time were 80 ℃ and 60 min respectively.