多处理器高速数据传输互联技术的设计与实现

Design and realization of interconnect technique for high-speed data transmission between multi-processors

为满足嵌入式系统中板内多数字信号处理器间高速数据传输技术需求,本文在分析现阶段常用多处理器互联方式后,设计了多DSP之间采用RapidIO技术利用SRIO接口完成不同速率的多处理器间的板内通信。该方法根据SRIO接口协议,在两片TMS320C6455间通过合理的设计与硬件配置很好地实现了多DSP间基于SRIO通信协议的高速数据传输。实测数据表明,本文所设计的多DSP互联架构每个数据传输通道最高读写速度可稳定工作在3.125Gb/s,为基于RapidIO技术的互联方案提供了参考。

In order to satisfy the need of the high-speed data transmission between the multiple digital signal processors in the printed circuit board of the embedded system,this paper analyzes the common multiprocessor interconnect technology, designs the technology of the RapidlO between the multi-DSP to realize the communication within the multiprocessor in the PCB by SRIO protocols.According to the SRIO communication protocols,with the reasonable design between the two TMS320C6455 and the hardware configuration,the problem of the high-speed data transmission between the multiprocessors has been solved.Experiments show that this design of structure of the multi-DSP achieves the maximum speed of data reading and writing which arrives at the speed of 3.125Gb/s for each data transfer channel. Furthermore,this design supplies the reference mode for the interconnect technique based on the RapidIO communication protocols.