摘要
对比了几种电镀锡体系的优缺点,介绍了甲基磺酸(MSA)体系电镀的镀液及镀层的特点,分析了甲基磺酸体系镀液稳定的原因。展望了甲基磺酸盐镀锡的发展前景。
The advantages and disadvantages of the system of several tinelectroplating were compared, the characteris- tics of methylsulfonate（MSA） plating bath and plating were introduced, and the reason of methylsulfonate plating bath stability was analyzed. The developing foreground of methylsulfonate tin and tin alloys plating was prospected.
出处
《湖南有色金属》
CAS
2013年第2期36-39,76,共5页
Hunan Nonferrous Metals
关键词
甲基磺酸
电镀锡
可焊性镀层
环保
MSA
tin plating
solderable plating
environmental protection
