摘要
采用1,3-二胺丙基-1,1,3,3-四甲基二硅氧烷(DSX)改性双酚F环氧树脂(BPFER)/2-乙基-4-甲基咪唑(2,4-EMI)体系。采用DSC研究BPFER/2,4-EMI/DSX体系的固化反应过程,并对树脂固化物进行了SEM、DSC、TG分析。结果表明,DSX改性BPFER/2,4-EMI固化物的力学性能明显提高;随DSX含量增加,材料的冲击断面趋于粗糙,韧性断裂特征逐渐明显;固化物的Tg有所下降,但当DSX含量为12.5%时,固化物仍具有良好的耐热变形性能。TG分析表明,固化物的起始热分解温度和400℃时的残余质量均逐渐提高,固化物的耐热性能明显改善。
The bisphenol F epoxy resin(BPFER)/2-ethyl-4-methylimidazole (2,4-EMI)system was modified with 1,3-bis (T- aminopropyl) tetramethyldisiloxane(DSX). The curing process of the modified system was investigated by differential scanning calo- rimetry(DSC) and the cured system was analyzed by means of scanning electron microscope( SEM ), DSC and thermogravimetric a- nalysis(TGA). The results show that the mechanical properties of the cured system are improved obviously by the incorporation of DSX. The SEM images suggest that fracture characteristics of the cured resins change from brittle to tough. The DSC curves demon- strate that the glass transition temperature( Tg )of the modified resins decreases gradually with the increase of DSX content,but still have good heat deformation properties when the content of DSX reaches 12.5 %. The TG curves show both the initial decomposition temperatures and the residual mass at 400℃ of the DSX modified resins are higher than those of the unmodified ones ,which suggest that the heat-resistance of BPFER/2,4-EMI system is improved greatly.
出处
《固体火箭技术》
EI
CAS
CSCD
北大核心
2013年第2期250-254,共5页
Journal of Solid Rocket Technology
基金
广东省教育部产学研合作项目(2010QSKJ0711)
关键词
双酚F环氧树脂
有机硅改性剂
固化反应
力学性能
耐热性能
bisphenol F epoxy resin
organosilicone modifier
curing reaction
mechanical property
heat-resistance