面积阵列焊球快速制备技术与装置

Printing method and micro-jetting system for rapid area array bumping

为实现面积阵列封装中焊料凸点阵列的快速制备,提出了一种气动膜片活塞式熔融焊料微滴按需喷射装置.该装置利用微滴按需喷射技术对焊料液滴体积与沉积位置的高精度控制,实现直接植球功能.实验研究了装置各参数对液滴形成的影响,并通过单喷嘴按需逐点喷射直接在铜基板表面制作了5×7Sn63Pb37焊球阵列.此外,实验通过3×3阵列孔喷嘴并行喷射在硅基板上制作了3×3焊料凸点阵列.结果表明:气动膜片活塞式微滴喷射装置能实现大小均匀、尺寸和定位精度可控的焊球面积阵列的快速制备.

To aim at solder balls array rapid bumping in area array packaging, a pneumatic diaphragm- piston-based drop-on-demand jetting system was proposed to eject droplets of molten solder at high temperature. The dispenser controlled the volume and deposition position of droplets with high accu- racy which enabled direct solder displacement. The performance of the droplet generator was experi mentally evaluated. In the presented configuration, the dispenser printed up to 5 × 7 Sn63 Pb37 solder ball array on copper substrate by single nozzle scanning mode. And 3 × 3 solder ball array was pro- duced by parallel jetting with 3 × 3 array nozzles achieved also. The experimental results show that the pneumatic diaphragm-piston-based jetting system can achieve solder balls array rapid bumping with high consistency and controllable accuracy for semiconductor packaging.