三维复杂微流体纺丝芯片的封装研究

Studies on the bonding technologies of a microfluidic spinning chip with three-dimensional complex structure

为了拓展微流体芯片的应用领域,以一种具有三层结构的多功能集成微流体纺丝芯片为例,利用去离子水和再生丝素蛋白水溶液,比较了环氧树脂粘合剂、硅胶粘合剂以及压敏胶对聚二甲基硅氧烷(PDMS)和纤维素膜的粘合效果,探讨了等离子处理、封装方式等三维复杂微流体芯片的封装技术,实现了多功能集成微流体纺丝芯片的有效封装,对具有类似结构的三维复杂微流体芯片的封装提供参考。

In order to expand the application fields of microfluidic chips, the bonding technology of a multifunctional microfluidic chip with three-layer structure was discussed. Three adhesives of epoxy adhesive, silicone adhesive and pressure-sensitive adhesive were used to bond polydimethylsiloxane （PDMS） and regenerated cellulose membrane, respectively. The bonding effects of the adhesives, plasma treatment and bonding method on the three-di- mensional complex microfluidic chip were investigated, using deionized water and regenerated silk fibroin aqueous solution. Results showed that the multifunetional microfluidic chip was bonded effectively by using the bonding technologies, which are very useful for the fabrication of the three-dimentional microfluidic chip with similar structures.