功率型LED散热基板制备研究

Study on Preparation and Properties of Heat-Release Substrates of High-Power LED

钨铜复合材料因具有高导热性、膨胀系数可调节等优点在大功率器件中作为散热基板被大力开发应用,然而表面难于绝缘化缺点阻碍其进一步推广。先后采用电解抛光预处理技术、AlCl3+LiAlH4有机镀铝技术和硫酸阳极氧化技术成功地在W90Cu10基板表面上制备出具备良好的表面质量和绝缘性能的氧化层。实验发现:经电解抛光预处理后,钨铜基板表面质量大幅提高,相对反射率高达90%以上,呈镜面光亮;采用AlCl3+LiAlH4有机溶剂电沉积制备出高纯镀层,外观呈银白色、均匀,表面颗粒排列紧密;镀铝层经硫酸阳极氧化处理后,氧化铝膜的表面由非晶Al2O3相组成,绝缘性能良好。

W-Cu composites are intensively developed as a new type of thermal substrate in high- power devices due to high thermal conductivity and adjustable thermal expansion coefficient. Howev- er, the poor hard-insulation surface limits their further application. By electro-polishing pretreatment, electro-deposition method and sulfuric acid anodizing method in this paper, metal-based insulating substrate,the oxide layer with good surface quality and insulating performance was successfully pre- pared. Experimental results show：After electro-polishing pretreatment, the surface quality of Wu-Cu foils was largely improved, the relative reflectivity of polishing surface is up to 90%, the surface is mirror bright, A1 coatings displayed silvery white, homogeneous and dense, the electroplating alumi- num coating after anodizing is composed of amorphous A12 O3, and has good insulating properties.