浅谈刚挠PCB的压合叠层

Rigid Flex PCB lamination bonding improvement

我公司加工刚挠产品时,需用到不流胶与低流胶PP;为保证刚挠产品不缺胶,我们需用缓冲垫以实现压力均匀化。但缓冲垫的使用,会给升温速率及叠层高度带来负面的影响。通过不同缓冲垫的性能比较,选出了一种升温速率快、操作更方便、价格更便宜的缓冲垫;在不影响产品的填胶效果及可靠性能的情况下,将刚挠产品的叠层大幅度提高。

When our company processes rigid flex products, it needs non flow glue and low flow adhesive PP. To ensure rigid Bending resistance scratch products do not lack of glue, we need cushion in order to realize pressure equalization. But the use of cushion brings highly negative influence to heating rate and lamination. In this paper, through different cushion performance comparison, we choose a kind of process which has faster heating rate, more convenient operation, cheaper price cushion. It does not affect the product fill glue effect and reliable performance, and will improve significantly the rigid flex products lamination.