两种多芯片封装设计及电性能分析比较

Electrical Performance Analysis and Comparison of Two Kinds of Multi-chip Package Design

集成电路发展迅速,为了提高芯片的集成度,高速高密的封装技术显得越来越重要。设计并分析了两种多芯片的封装实例,一种是二维多芯片封装,另一种是基于柔性基板的三维多芯片封装,并通过三维电磁仿真软件分别对它们进行了频域和时域的仿真。研究了关键信号的传输特性以及驱动和接收芯片间的信号眼图。对于两种封装形式,仿真结果表明在关键信号传输质量方面前者稍好于后者,但后者在减小封装面积和重量方面具有优势。

The integrated circuit has developed rapidly, in order to improve the integration of the chip, high speed and high density packaging technology is becoming more and more important. Two kinds of multi-chip pack- age are designed and analyzed, one is two-dimensional multi-chip package, the other is three-dimensional multi- chip package based on the flexible substrate. They are simulated respectively in frequency domain and time domain by 3D electromagnetic simulation software, the transmission characteristics of key signal nal between driver and receiver chips are researched. For the two package type, the sire and the eye diagram of sig- ulation results show that the former is slightly better than the latter in terms of the key signal transmission quality, but the latter has advantages in reducing the size and weight of package.