基于单片机的X射线测厚仪数据采集系统设计

Design of X-ray Thickness Gauge’s Data Acquisition System Based on MCU

传统的X射线测厚仪采用工业控制计算机实现数据采集与处理功能,针对其系统结构复杂、成本高的缺点,提出基于高速单片机的数据采集与处理方案。以C8051F060高速单片机为核心芯片,对HRX-40型X射线测厚仪的数据采集与处理系统进行软硬件设计,X射线探头将衰减后的X射线转换为电流信号,经高灵敏度的电流放大器AD549放大后,由轨到轨高速运算放大器LT1806构成的电压跟随器送到单片机的16位ADC输入通道进行电压采样,采样后的数据由单片机处理后得到被测板材厚度值,再由增强型UART串口输出至LED显示屏实时显示。通过所制作样机的实验数据验证了设计的正确性和可行性。

Relative to the traditional X-ray thickness gauge that adopts industry control computer to realize data acquisition and processing, a data acquisition and processing program that based on high-speed microcontroller is presented to overcome the shortcomings of complicated system structure and high cost. Using C8051F060 high-speed microcontroller as the core, the data acquisition and processing system of HRX-40 X-ray thickness gauge is designed with software and hardware, and the attenuated X-ray is transformed into current signal by X-ray probe, then the current signal is amplified by AD549 current amplifier, which is sent to 16 bits ADC input channel of MCU for sampling voltage by voltage follower that is composed of rail-to-rail high-speed operation amplifier LT1806, then the thickness of measured panel can be calculated, when the sampled data is dealt with by MCU, and the value of thickness is outputted to LED displaying screen and displayed in time. At last, the validity and feasibility of design are verified according to the experimental data of the made prototype.