润湿性及孔径均匀性对铜液在多孔W骨架中渗流过程的影响

Effects of Wettability and Pore Size Uniformity of the Channel on Infiltration Process of Liquid Copper in W Skeleton

采用Voronoi随机算法建立微尺度W骨架多孔模型,基于Young-Laplace修正后的Navier-Stokes动量方程,应用有限体积法分析制备CuW合金的渗流过程。模拟结果表明:Cu-W间的润湿性越好,则铜液流股中心流速越大,但铜液在骨架壁面的黏附越强,从而有利于铜液与壁面接触而产生机械结合。此外,渗流通道中由于孔径不均匀引起的扩孔与缩孔转变导致铜液在孔隙中形成漩涡,促使CuW合金中产生气孔,从而降低铜液的充填率。

A micro-scale W skeleton porous model was built by random Voronoi segments, and the infiltration process of CuW alloy was then simulated using a finite volume method based on the Navier-Stokes momentum equation modified by Young-Laplace. The simulation results show that improving the wettability of Cu-W can accelerate the velocity in the center of copper flow and strengthen the adhesion of liquid copper to the wall of W skeleton, resulting in the mechanical combination at the interface of Cu-W. Moreover, the transition of reaming and shrinkage due to the ununiform pore size can produce whirlpools of copper liquid in the pores, resulting in pores in the CuW alloy, and thus the filling rate of copper liquid is decreased.