摘要
介绍了导电银胶的典型体系、导电机理;重点阐述了LED封装用高可靠导电银胶的主要性能指标、测试技术和发展趋势。
The typical system and conductive mechanism of the silver conductive adhesive were introduced. The typ- ical characteristics, test technologies and developing trend of the high reliable conductive silver adhesive for LED packaging were also reviewed.
出处
《化工新型材料》
CAS
CSCD
北大核心
2013年第5期58-59,67,共3页
New Chemical Materials
关键词
LED封装
导电银胶
LED packaging,conductive adhesive