封装用环氧模塑料制备及其线膨胀性能研究

Experiment Investigation of Epoxy Resin Molding and Coefficient of Thermal Expansion for Electronic Packaging

文章主要对集成电路封装用环氧树脂模塑料的配方进行研究,以高纯度酚醛环氧树脂为基体树脂,二甲基咪唑为催化剂,分别以结晶硅微粉、熔融硅微粉、球形硅微粉为填充料,通过改变催化剂、偶联剂、固化剂和填充料的类型或用量,并通过添加纳米二氧化硅改性剂,从而获得各配方环氧树脂模塑料扫描电子显微镜表征的微观结构、线膨胀系数等性能。进而对封装用塑料进行配方优化,获得较优配方,使环氧塑封料达到线膨胀系数小、应力低的目的,使之合乎大规模集成电路封装用模塑料的性能要求。

Formulas of epoxy resin molding compound for electronic packaging is investigated in this article. Epoxy resin is substrate, dimethy-imidazole is agent, fillers are crystal silicon powder, fused silicon powder, global silicon powder, by changing of activator agent, cross-linker, curing agent, filler＇s type and fraction, by the way of adding nanometer silicon powder modifier. We compare their microstructure, coefficient of thermal expansion etc by SEM with different formulas. Then formulas is developed to get better properties of epoxy resin packaging matrix, better coefficient of thermal expansion, low stress, to match the requirements of large number of IC and electronic packaging performance.