摘要
以流延法制备H+质子化壳聚糖和中性壳聚糖膜材,在-100~345℃范围用动态机械热分析仪(DMTA)研究H+质子化壳聚糖膜材动态储能模量E'、动态损耗模量E″和力学损耗因子tanδ的温度谱和频率谱,结合X射线、红外光谱、扫描电镜和热重差热分析,探讨H+质子化对壳聚糖膜材动态力学行为及其热稳定性的影响.
The protonation and deprotonation chitosan solid films were method. The two kinds of films microstructure and physical-chemical changes prepared by solution have been character- ized by scanning electron microscopy (SEM), X ray diffraction (XRD), the thermal gravimeric a- nalysis (TG) and differential scanning calorimetry (DSC). Dynamic mechanical thermal analysis (DMTA) was used to measure the temperature spectra of the dynamic storage modulus (E'), dy- namic loss modulus (E") and the mechanical loss tangent (tan 8) for investigating the protonation influence on the dynamic mechanical behavior and mechanical property thermal stability of the chi- tosan solid film between - 100 - 345 ℃.
出处
《福建师范大学学报(自然科学版)》
CAS
CSCD
北大核心
2013年第3期68-74,90,共8页
Journal of Fujian Normal University:Natural Science Edition
基金
福建省科技厅重大项目(2010H6006)