环氧树脂导电胶用铜粉抗氧化性

Anti-oxidation of Epoxy Resin Conductive Adhesive Copper Powder

根据铜本身具有的性质,选用γ-氨丙基甲基二乙氧基硅烷(KH-902)对铜粉进行改性,并采用FT-IR、超景深显微镜、TG、SEM及EDS技术对改性铜粉及铜粉导电胶进行表征。结果表明,添加硅烷偶联剂KH-902可以有效改善铜粉的易氧化的问题,当添加量为3%时,不仅可以明显改善铜粉导电胶在高温固化下抗氧化性能,而且铜粉在环氧树脂胶体体系中能够均匀分散,且铜粉与铜粉之间的搭接紧密,具有良好的导电性能,体积电阻率仅1.31×10-2Ω.cm。

According to the nature of copper, γ-amino propyl methyl di-ethoxy-silane（KH-902） is selected to modify copper. FT-IR, digital microscope, TG, SEM and EDS have been used to characterize the modified copper and the copper-filled conductive adhesive. The results show that the addition of silane coupling agent KH-902 can improve the antioxidation ability. When the addition of KH-902 is 3%, it can significantly improve not only the oxidation resistance of the copperfilled conductive adhesive in high temperature curing, but also the dispersion of copper in the epoxy resin colloid system, and make the combination between copper and copper better, which is the superior conductivity of system with bulk resistance rate of 1.31×10-2 Ω·cm.