高质量PCB孔壁状态加工技术的研究与控制

Process technology research and control of hole wall condition of high quality PCB

孔壁状态是钻孔品质最重要技术指标之一,是反映钻孔加工技术水平的高低、钻孔产品质量的优劣甚至整个PCB制造水平都具有一定的代表性,可见孔壁状态对产品质量影响的重要性!在这个追求更高性价比的时代,随着现代化科学技术日新月异的快速发展,PCB的应用正向着更高端水平、更广阔领域、更低廉成本的方向发展,高质量、高性能、低成本、低报废正成努力工作目标与方向,并成为业界共识!通过对钻削热、钻削参数、刀具管控、散热系统等几方面进行研究、分析与控制,并在板材等大环境一定的前提下使孔壁状态与改善前取得了非常显著的效果!彻底解决了钉头、灯芯、分层、孔壁粗糙度超差、内层焊盘脱落等一系列严重影响产品质量的技术难题,特别是针对420 m以上超厚铜板、φ0.20mm以下微小孔径板更是取得了非常显著的效果!

The condition of hole wall is one of the most important technical targets. It is representative for the technical level and production quality of drilling, even for the manufacture level of PCB. So it is very important to production quality. In current times, people seek more balance between performance and price. Along with the rapid development of modernize technology, for the application of PCB, the level is higher, the field is wider, and the cost is cheaper. So most people in trading business agree that there is contradiction between high quality, high performance, high reliability and low price. Low cost, low scrap is the primary target. This paper describes that through the precondition of invariability raw material, we improved the condition of hole wall evidently through the investigation, analysis and control for drilling caloric, drill parameter, drills and thermal shunt system. And we resolved a series of technical problems which could affect the production quality seriously, such as nailhead, lampwick, delamination, roughness of hole wall exceeding spec, pads of inner layer peeling off, and so on, especially for the heavy copper boards （copper thickness is more than 420μm）, big aperture boards, and micro aperture boards （hole diameter is less than Ф0.20mm）.