电镀硬质氧化铝薄膜热残余应力测量

Measurement of Thermal Residual Stress of Electroplate Hard Alumina Films

欲改善电镀氧化铝薄膜/铝合金基体体系的服役寿命,需从整体上掌握其力学性能。为此,分别制备了特殊的铝合金热残余应力试样和沉积夹具,采用硫酸阳极氧化法在铝合金基体上制备了10～60μm厚电镀硬质氧化铝,通过曲率法测试了试样的热残余应力,并分析了薄膜厚度与其热残余应力之间的关系。结果表明:10～60μm厚的电镀硬质氧化铝薄膜热残余应力为较小的拉应力,且随着厚度的增加,应力值呈线性下降趋势。

In order to improve the service life of the electroplating alumina film/Al-alloy substrate systems,it is necessary to know their whole mechanical characteristics.Therefore,the special thermal residual stress specimen and depositing fixtures were prepared,respectively.Alumina films of 10~60 μm thickness were prepared by a positive pole oxidized technology in the sulfuric acid electroplating solution.The thermal residual stress of electroplating alumina films were measured by curvature method.and the relationship between thickness and residual stress of alumina films was also analyzed.It concluded that the residual stresses of electroplating hard alumina films were relatively small and tensile stress corresponding to 10~60 μm thickness,and the residual stresses decreased linearly with increasing thickness.