摘要
针对一个具体的电子设备,分析机箱内部的传热类型,采用专业的热分析软件Icepak对其进行稳态热仿真,求解封闭结构达到热平衡时的温度场,指出内部器件温度超过允许温度上限的原因,提出两种改进结构形式的措施,重新计算在前后面板开通风孔散热的机箱内部温度场。计算结果显示,内部器件最高温度在允许工作范围内,从而有效降低了电子设备机箱内温度,保证设备稳定可靠工作,提高结构设计与改进的效率。
Types of thermal transmission in chassis for one special electronic equipment are analyzed. Steady thermal simulation is performed by professional thermal analysis software Icepak. To calculate the temper- ature field when the blocked structure getting heat equilibrium, reasons that the temperature of inner devices is above upper limited temperature are explained. Two methods for improving structures are proposed. Temperature field in chassis with vent holes on front and back panels for heat exhaust is calculated again. Calculation results show that the highest temperature in inner devices is in permitted operation temperature range. So the temperature in chassis is reduced effectively to ensure the equipments in stable and reliable operation states. And structure design and improvement effectiveness are enhanced.
出处
《光电技术应用》
2013年第3期64-67,共4页
Electro-Optic Technology Application
