摘要
介绍一种可以用于制作印制线路而且能电子焊接的低温硬化型导电涂料,它由银包镍金属粉末与酚醛树脂以及油酸三者配比而成,其导电性可达2.0×10-4Ω.cm,与无铅焊料的密着强度可达8.2 N/mm2。本文叙述了不同配比的涂料与体积电阻率的关系和与焊料密着强度的关系,以及该涂料在高温高湿环境下的耐热性和耐湿性。
The low temperature curing conductive ink is introduced which can be used to produce the print wie- ing and is solderable. The ink consist of silver plating nickel power, phenolic resin and oleic acid, and its conduc- tivity is up to 2.0×10￥-4Ω·cm, and its adhesive strength with lead-free solder is up to 8.2 N/m㎡. The relation- ships between paint with different proportions and volume resistivity or solder adhesive strength are all described. And the thermal-proof characteristics and moisture-proof characteristics of this ink＇ in environment of high tempera- ture and humidity are also analyzed.
出处
《科学技术与工程》
北大核心
2013年第16期4676-4681,共6页
Science Technology and Engineering
基金
北京市教育委员会科研基地项目(110601203)资助
关键词
低温硬化
导电涂料
银包镍金属粉末
酚醛树脂
油酸
无铅焊料
low temperature curingoleic acid lead-free solderconductive ink silver plating nickel powerphenolic resin
