期刊文献+

轨道交通用IGBT模块互连技术及其发展趋势 被引量:4

Technical Progress and Trend of Interconnection in IGBT Module for Railway Transportation
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摘要 从焊接、键合及压接三方面介绍了模块封装的各种互连技术,分析了各种互连方式的发展现状及其特点,总结了轨道交通用IGBT模块封装中的互连技术的发展方向。 All the interconnection technologies of IGBT module from soldering,bonding and pressure contact were introduced respectively,the development status and technical features of the interconnections were analyzed,and development directions of each interconnection technique were summarized.
出处 《机车电传动》 北大核心 2013年第3期1-5,共5页 Electric Drive for Locomotives
关键词 IGBT模块 互连技术 焊接 键合 压接 轨道交通 IGBT module interconnection technology soldering bonding pressure contact railway transportation
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参考文献35

  • 1Thomas Sch tl tze, et al. Further Improvements in the Reliability of IGBT Modules[J] IAS, 1998( 2 ): 1022-1025.
  • 2Hunger T, et al. Extended Reliability of substrate solder joints in power modules[J]. EPE, 2009:1-8.
  • 3Nicholas D Benavides, et al. Reliability Improvements in Inte- grated Power Systems with Pressure-contact semiconductors [ J ]. ASNE Day, 2009.
  • 4Raed A Amro. Packaging and interconnection technologies of power devices, challenges and future trends [ J World Academy of Science, Engineering and Technology, 2009( 49 ): 691-694.
  • 5Elisabeth Schulze, Christian Mertens, Andreas Lindemann. Low Temperature Joining Technique- a Solution for Automotive Power Electronics[ J ]. Proceedings of PCIM Europe Confer- ence, 2009( 30 ): 217-222.
  • 6Tsuyoshi Yamamoto, Ken-ichiro Tsubone. Assembly technology using lead free solder[ J FUJITSU Sci. Tech., 2007, 43( 1 ): 50-58.
  • 7Edwin Bradley. Lead-free Solder Assembly: Impact and Oppor- tunity[ J ]. Proceedings of 53rd Electronic Components and Technology Conference, 2003( 53 ): 41-46.
  • 8Elisabeth Schulze, Christian Mertens, Andreas Lindemann. 'ew module concepts exclusively built with low temperature joiningtechnique for single- and double-sided cooling [ J Proceedings of PCIM Europe Conference, 2010( 31 ): 255-260.
  • 9C Goebl, J Faltenbacher. Low temperature sinter technology die attachment for power electronic applications J Proceedings of CIPS 2010, 2010( 6 ): 327-332.
  • 10C Mertens J Rudzki, R Sittig. Top-Side Chip Contacts with Low Temperature Joining Technique ( LTJT )[ J The 35 th Annual IEEE Power Electronics Specialists Conference, 2004( 35 ): 4178 -4182.

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  • 1胡佳贤,韩雁,张世峰.高压VDMOS结终端技术研究[J].半导体技术,2010,35(增刊):52-61.
  • 2Rahimo M, Kopta A, Linder S. Novel Enhanced-Planar IGBT Technology Rated up to 6.5 kV for Lower Losses and Higher SOA Capability[J] ISPSD, 2006: 1-4.
  • 3Piotr Musznicki, Jean-Luc Schanen, Piotr Chrzan. Design of high voltage busbar: trade off between electrical field and stray inductance [J]. CPE, 2003: 1-5.
  • 4Ole Muhlfeld, W-Toke Franke, Friedrich W Fuchs. Design Strategies for Stray Inductance optimized Wire-Bond Power Modules[J]. PCIM, 2010: 231-235.
  • 5Daniel Schneider, Lydia Feller, Dominik Trussel, et al. Designing an IGBT Module Packaging for High Quality and Reliable Operation [J]. PCIM, 2008 : 1-7.
  • 6Takashi Kojima, Yasushi Yamada, Mauro Ciappa, et al. A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications[J]. ISPSD, 2004: 289- 292.
  • 7Schutze T, Berg H, Hierholzer M Reliability of IGBT Modules[J] tions Conference IAS 33,1998: Further Improvements in the Proc IEEE Industry Applica- 1022-1025.
  • 8张希川,张海滨,左丽娜,张悦.铜铝管技术在制冷空调行业中的应用研究[J].制冷与空调,2008,8(B06):92-105. 被引量:16
  • 9赵越,左铁军,王昕,尹衍升,王岩.“铜铝铜空调连接管”的开发与应用[J].制冷与空调,2008,8(B06):106-111. 被引量:9
  • 10余世峰,阮江军,刘兵,黄道春,杜志叶,皇甫成.VSC-HVDC换流站电磁辐射计算[J].高电压技术,2009,35(8):1980-1985. 被引量:12

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