摘要
从焊接、键合及压接三方面介绍了模块封装的各种互连技术,分析了各种互连方式的发展现状及其特点,总结了轨道交通用IGBT模块封装中的互连技术的发展方向。
All the interconnection technologies of IGBT module from soldering,bonding and pressure contact were introduced respectively,the development status and technical features of the interconnections were analyzed,and development directions of each interconnection technique were summarized.
出处
《机车电传动》
北大核心
2013年第3期1-5,共5页
Electric Drive for Locomotives
关键词
IGBT模块
互连技术
焊接
键合
压接
轨道交通
IGBT module
interconnection technology
soldering
bonding
pressure contact
railway transportation