期刊文献+

A DEVELOPED FULL-FIELD FEM ANALYSIS COMBINED WITH ESPI FOR THE INVESTIGATION OF DEFECT EVOLUTION IN POLYMER FILMS

A DEVELOPED FULL-FIELD FEM ANALYSIS COMBINED WITH ESPI FOR THE INVESTIGATION OF DEFECT EVOLUTION IN POLYMER FILMS
原文传递
导出
摘要 A full-field finite element method (FEM) analysis combined with electronic speckle pattern interferometry (ESPI) measurement was developed to investigate defect evolution in polymer films. Different from the previous reports, which only compare the ESPI experimental and FEM simulated results at several points or lines, herein the full-field FEM results were exported, subtracted with a continuous distribution. By choosing proper parameters and number of substeps, the simulated and experimental results showed excellent correspondence. Furthermore, the displacement fields vertical to the tensional direction were also presented, and the strain field was preliminarily evaluated. The current method of combination of ESPI and FEM allows for capturing the experimental fringe maps to validate and optimize FEM results simulated, and would give a higher security to structural and mechanical analysis of polymeric materials. A full-field finite element method (FEM) analysis combined with electronic speckle pattern interferometry (ESPI) measurement was developed to investigate defect evolution in polymer films. Different from the previous reports, which only compare the ESPI experimental and FEM simulated results at several points or lines, herein the full-field FEM results were exported, subtracted with a continuous distribution. By choosing proper parameters and number of substeps, the simulated and experimental results showed excellent correspondence. Furthermore, the displacement fields vertical to the tensional direction were also presented, and the strain field was preliminarily evaluated. The current method of combination of ESPI and FEM allows for capturing the experimental fringe maps to validate and optimize FEM results simulated, and would give a higher security to structural and mechanical analysis of polymeric materials.
出处 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2013年第7期1022-1028,共7页 高分子科学(英文版)
基金 financially supported by NSFC (No. 201121001)
关键词 Electronic speckle pattern interferometry Finite element method DEFECT In-plane displacement Polymer film. Electronic speckle pattern interferometry Finite element method Defect In-plane displacement Polymer film.
  • 相关文献

参考文献35

  • 1Tan, H.G., Wang, Z.Y., Zhu, W.F., Song, Q.G., Li, H. and Bai, C.Q., Chinese l Polym. Sci., 2008, 26(6): 759.
  • 2Huo, n.x, Yuan, X.H., Liu, D.Z., Zhang, L. and Wang, F., Chinese J. Polym. Sci., 2008, 26(1): 39.
  • 3Huang, P., Zhang, G.x., Wu, Z. T., Cai, J.H. and Zhou, Z.K., NDT &E Int., 2006, 39: 578.
  • 4Arman, Y., Zor, M. and Aksoy, S., Compos. Sci. Technol., 2006, 66: 2945.
  • 5Li, H.Z., Jia, Y.X., Mamtimin, G., Jiang, W. and An, L.J., J. Appl. Polym. Sci., 2007,103: 64.
  • 6Ghiglia, D.C. and Pritt, M.D., "Two-dimensional phase unwrapping: theory, algorithms, and software", Wiley, New York, 1998.
  • 7Nelson, D.V. and McCrickerd, J.T., Exp. Mech., 1986,26: 371.
  • 8Lin, S.T., Hsieh, C.T. and Lee, C.K., Proc. SPIE, 1995,2577: 226.
  • 9Joh, D., Byun, K.J. and Ha, J., Exp. Mech., 1994,35: 70.
  • 10Nicoletto, G., Exp. Mech., 1991,31: 252.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部