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TG-siloxane改性BPFER/mXDA体系固化反应动力学与热性能 被引量:2

Curing kinetics and thermal properties of TG-siloxane modified BPFER/mXDA system
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摘要 以1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(DSX)和环氧氯丙烷(ECH)为原料,利用相转移催化剂,合成双酚F环氧树脂(BPFER)改性剂N,N,N′,N′-四缩水甘油基-1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(TG-siloxane),并用FTIR、13 C NMR谱图对其结构进行了表征。对TG-siloxane改性BPFER/mXDA(间苯二甲胺)体系的固化动力学进行了研究。根据DSC曲线和Starink方程,得该体系表观固化活化能为51.52kJ.mol-1。用esták-Berggren模型求得不同升温速率下的表观因子、反应级数。动力学方程表明,升温速率对固化反应影响明显;所得方程用于预估反应进程时,与实测值吻合程度高。TG分析表明,TG-siloxane改性BPFER/mXDA体系固化物的耐热性能优于单纯BPFER/mXDA固化物。 N, N, N', N'-tetraglycidyl 1,3 - diamino-propyl-1,1,3,3-tetramethyl disiloxane (TG-siloxane) was synthesized by using phase transfer catalyst and was characterized with FTIR and laC NMR. The kinetics of curing reaction for a system of bisphenol F epoxy resin (BPFER)/TG-siloxane with mxylylenediamine (mXDA) as curing agent was monitored with differential scanning calorimetry (DSC). The apparent activation energy was obtained by the Starink equation. The kinetic parameters, such as frequency factor and the values of reaction order were obtained based on the Sestdk-Berggren model. The kinetic equation suggested that the curing reaction was influenced greatly by heating rate. It was shown that the predicted reaction progress was very close to the experiment. The TG curves indicated that cured BPFER/TG-siloxane/mXDA system had better heat-resistance than that of BPFER/mXDA.
出处 《化工学报》 EI CAS CSCD 北大核心 2013年第6期2080-2085,共6页 CIESC Journal
基金 广东省教育部产学研合作项目(2010QSKJ0711)~~
关键词 固化反应动力学 差示扫描量热法 耐热性 双酚F环氧树脂 有机硅改性剂 curing reaction kinetics differential scanning calorimetry heat-resistance bisphenol F epoxy resin silicon modifier
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