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型材弯曲中断裂缺陷的探讨 被引量:3

Discussion about fracture in profile bending process
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摘要 针对双室型材弯曲工艺,通过单向拉伸试验,获得材料的弹性模量等基本材料性能参数,基于有限元软件ABAQUS,通过简化模型、合理设置接触摩擦、体壳单元不同选择等,进行有限元仿真,获得成形后应力和厚度减薄量的分布,得出小半径成形应力应变偏大。通过设计试验,验证了有限元仿真的正确性,并对断裂件进行原因分析,得出进给量和材料性能为主要影响参数,并提出相应的改进措施。 According to the double chamber profile bending process, the modulus of elasticity and other basic parame- ters of the material were obtained with standard uniaxial tensile test. Based on the finite element software ABAQUS, the simulation was made by rational simplified model, reasonable friction, different element types (solid and shell), and the distributions of stress and thickness reduction after forming were got. The results show that the stress and strain of minor radius was larger. Some experiments were done to have a confirmation and to analyze the causes of fail- ure. The main influencing parameters of amount of feed and material property were got and the corresponding measures were put forward.
出处 《锻压技术》 CAS CSCD 北大核心 2013年第3期75-79,共5页 Forging & Stamping Technology
关键词 压弯 有限元模拟 型材 厚度减薄 bending FEM profile thickness reduction
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