微量Te对Cu-30CrTe合金触头材料抗焊接性的影响

Effects of Trace Te on Anti-welding Property of Cu-30CrTe Alloy Contact Material

使用光学显微镜和扫描电镜(SEM)观察熔铸Cu-30CrTe、Cu-30Cr和烧结粉末冶金CuCr25等三种触头材料经真空扩散焊后的室温拉伸断口及焊接结合区纵断面的显微组织。三种触头材料具有不同的断裂特征,熔铸Cu-30CrTe材料焊接结合面的显微组织明显不同于烧结CuCr25;同时参考X射线光电子能谱(XPS)表面分析结果,对添加微量Te改进触头材料抗焊接性的机理和评判原则进行了讨论。

The tensile fracture at room temperature and the faying microstructures of vacuum casting Cu-30CrTe, Cu-30Cr and sintered CuCr25 contact materials after diffusion welding in vacuum were evaluated by optical microscope and SEM. It is found that there are different fracture characteristics in the materials and distinct microstructures formed at the laying surface of the Cu-30CrTe from that of the sintered CuCr25; meanwhile consulting the XPS surface analysis results of elemental content and valence state of trace Te in the Cu-30CrTe contact material, the mechanism and principles of trace Te improving the anti-welding property of the Cu-30CrTe alloy contact material are discussed.