铜基上化学镀锡

Electroless Sn on Copper Substrate

研究了化学镀锡工艺 ,结果表明 ,随着镀液温度的升高 ,化学镀锡的沉积速率提高 ,当温度达到 80°C时 ,沉积速率最高 ;若继续升高镀液温度 ,沉积速率却降低。此外 ,化学镀锡的沉积速率随化学镀时间的延长而增加。镀液稳定可靠 。

Electroless tin plating is studied. Results show deposition rate of electroless tin increases with the rise of bath temperature, and it reaches peak value when bath temperature is at 80°C; while the deposition rate decreases when bath temperature is raised continuously. Besides, deposition rate of electroless tin also increases with increasing plating time. Bright tin coating is obtained, and the bath is stable and reliable.