硅晶棒内圆锯切加工过程的锯切力分析

An Analysis of Sawing Force in ID Slicing Process of Silicon Ingot

通过对内圆锯切力进行计算分析,分析了内圆锯片锯切硅晶棒的锯切力特征以及进给速度、主轴转速和工件尺寸等锯切工艺参数对锯切力的影响。由计算分析可知,锯切力是连续变化的,变化特征与接触弧长的变化特征相同,法向锯切力比切向锯切力对锯切加工过程的影响更显著;锯切工艺参数对内圆锯切力的影响明显,对锯切工艺参数进行合理选择和优化改善接触弧长,可有效改善锯切力状态,保证锯切加工过程的平稳性。

Through calculating the sawing force of ID slicing, the force characteristics and the influence of feed speed, rotate speed and diaraeter of workpiece on the sawing force were analyzed. The sawing force and the contact arc length have the same change characteristics. And the normal force affects more on the ID slicing process than the tangential force. In order to obtain a stable sawing process, we should choose more reasonable cutting pammeteps and optimize the arc length between ID blade and workpiece.