期刊文献+

无卤阻燃胶粘剂在挠性覆铜板中的应用研究

Study on Application of Halogen-free Flame-retardant Adhesive in Flexible Copper Clad Laminate
下载PDF
导出
摘要 运用磷阻燃、成碳阻燃和橡胶增韧技术,制备一种无卤阻燃的改性环氧树脂胶粘剂,应用于聚酰亚胺薄膜基挠性覆铜板中,考察了涂胶厚度及固化工艺对板材性能的影响,得到合适的固化条件是160℃、2 h。板材不含有卤素,具有优秀的剥离强度、耐折性、耐化学性、耐热性和电性能,阻燃性达到UL94 V-0级,性能达到IPC-4204A标准要求。 The halogen-free flame-resistant adhesive was prepared by the technology of phosphorus flame-retardant, Charring flame-retardant, and rubber toughened. The adhesive was applied on polyimide film based flexible copper clad laminate (FCCL). Studying on the impact of adhesive thickness and curing conditions on the FCCL performance, and the best curing condition was 160 ℃, 2 h. The test results of general properties of FCCL showed that it was halogen-flee, had high peel strength, excellent folding endurance, chemical resistance, solder resistance and electrical properties, flame retardancy achieved UL94 V-0 level, and compatible with IPC-4204 standard.
出处 《广东化工》 CAS 2013年第12期51-53,共3页 Guangdong Chemical Industry
关键词 挠性覆铜板 无卤 阻燃 胶粘剂 聚酰亚胺薄膜 flexible copper clad laminate (FCCL) halogen-free flammable-retardant adhesive polyimide film
  • 相关文献

参考文献6

  • 1Prismark partners LLC. The printed circuit report fourth quarter 2012[R]. NYUSA: PrismarkpartnersLLC, 2013.
  • 2刘生鹏,茹敬宏,伍宏奎.环保无卤型挠性覆铜板的研究进展[J].绝缘材料,2007,40(6):27-29. 被引量:5
  • 3张道智,沈里正.电子构装用绿色无卤材料技术之近况发展与挑战[J].工业材料杂志,2007(251):89-97.
  • 4伍宏奎,杨宏.三层挠性覆铜板的耐折性研究[J].印制电路信息,2008,16(7):25-28. 被引量:3
  • 5JPCA-ES-01-2003,印制板用无卤型覆铜板试验方法[S].日本:日本电子封装和电路协会(JPCA),2003.
  • 6IPC-4204A,挠性印制电路用的挠性覆金属箔绝缘材料[s].美国:国际电子工业联接协会(IPC),2011.

二级参考文献16

  • 1印牧典子,小川桂.难燃性接着剂组成物、フレキツブル铜张板、カバ-レィ及び接着フィルム:特开,75,748[P].2004-03-11.
  • 2Toru Nakanishi,Kazunori Kondo, Shigehiro Hoshida. Flame Retardant Adhesive Composition, and Adhesive Sheet,Coverlay Film and Flexible Copper-clad Laminate Using Same : US, 234,045[ P ]. 2006 - 10 - 19.
  • 3风间真一.耐热性无卤素挠性印制板基材的开发及其应用[J].工レクトロニクス实装学会志,2004,7(5).
  • 4及川太,白石成史.ハログソフリ-难燃性接着剂组成物及びカバ-レィフィルム:特开,137,437[P].2004-05-13.
  • 5Nogami,Kouichi,Esaki Yoshiakl, Ozeki Takayoshi. Halogen- free Epoxy Resin Composition, Coverlay Film, Bonding Sheet,Prepreg,Laminated Sheet for Printed Wiring Board: WO, 63,580[ P]. 2007 - 07 - 06.
  • 6邱国展.新世代无卤无磷型铜箔基板材料技术开发.工业材料,2003,(200):139-146.
  • 7曾峰柏.环保型基板材料趋势.电子与材料,2005,(27):56-71.
  • 8邱国展.新型无卤无磷基板材料技术开发.工业材料,2002,187:137-145.
  • 9中西畅,近藤合纪,星田繁宏,等.阻燃粘合剂组合物以及使用它的粘合片材、覆盖薄膜和柔性镀铜层压板:CN,1,847,352A[P].2006-10-18.
  • 10Toru Nakanishi, Hitoshi Arai, Michio Aizawa. Flame Retar- dant Adhesive Composition,and Adhesive Sheet,Coverlay Film and Flexible Copper-clad Laminate Using Same:US, 196,619[P]. 2005 - 09 - 08.

共引文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部