高频声表面波器件用压电晶圆清洗技术研究

Study on the Cleaning Technique of Piezoelectric Wafer for SAW Device with High Frequency

论述了低浓度碱性过氧化氢清洗液兆声清洗钽酸锂、铌酸锂和水晶等压电晶圆的工艺技术。在保持压电晶圆特性的前提下,该技术可有效去除晶圆表面小于0.2μm的附着颗粒,使其表面洁净度满足亚微米线宽高频声表面波(SAW)器件生产要求,同时降低了化学品、去离子水的消耗量及对环境的污染。

The megasonic cleaning technique using the alkaline hydrogen peroxide solution with light concentra- tion to clean the piezoelectric wafers such as LiTaO3, LiNbO3 and quartz has been presented in this paper. The par- ticles with size of less than 0.2μm adhered to the surface of the wafer can be removed effectively by using this tech- nique without damaging the characteristics of the piezoelectric wafers. The surface cleanliness of the wafer can satis- fy the mass-production requirements for high frequency SAW devices with submicron line-width while the consump- tion quantities of chemical products and deionized water can be cut down as well as the circumstance pollution risk can be reduced.