高温合金GH4169真空扩散连接工艺

Vacuum diffusion bonding of GH4169 superalloy

采用真空直接扩散以及加镍中间层对高温合金GH4169进行了连接,阐述了扩散连接工艺参数对接头界面和接头力学性能的影响,以孔隙的多少作为评价指标来说明工艺参数对接头的影响.GH4169的直接扩散连接,升高加热温度、延长保温时间和增大连接压力均会不同程度的使界面的孔隙数目减少、尺寸变小.连接温度1 100℃,保温时间90 min,连接压力40 MPa时,扩散孔隙基本消失,接头平均抗拉强度达到658MPa.采用镍中间层对GH4169进行扩散连接,接头塑性得到改善,接头抗拉强度得到明显提高;连接温度990℃,保温时间75 min,连接压力15 MPa时,接头抗拉强度达到840 MPa.

GH4169 superalloy was bonded to itself by vacuum diffusion bonding with Ni interlayer.The effect of process parameters on the interface structure and mechanical properties of the joints was investigated.The bonding holes in the interface were used as the evaluation indicator.The experimental results without Ni interlayer show that,with the increase of heating temperature,diffusion time and diffusion pressure,the number and size of bonding holes in the interface decreased.When the bonding temperature was 1 100 ℃,the bonding time was 90 min and the pressure was 40 MPa,the diffusion holes almost disappeared,and the average tensile strength reached 658 MPa.With Ni interlayer,the briquettability of the joint was improved and the average tensile strength apparently increased.When the bonding temperature was 990 ℃,the bonding time was 75 min and the pressure was 15 MPa,the average tensile strength reached 840 MPa.