摘要
主要从有机硅改性环氧树脂材料、有机硅树脂封装材料和改性有机硅封装材料三个方面综述了近几年有机硅材料在LED封装中的应用及其进展。对LED电子器件的高透光率、高折光率、高导热率、耐黄变等方面与有机硅材料化学结构进行对比分析,总结其优缺点,提出有机硅材料在LED封装应用中出现了折射率低、粘度低等问题,解决这些问题可能是今后这一课题的研究重点。
The application and progress of organic silicone material of the LED packaging in recent years, inclu-ding organic silicone modified epoxy resin material, organic silicone resin packaging material and modified silicone packaging material~ are reviewed. The high transmittance, high refractive index, high thermal conductivity, resis-tance to yellowing of LED electronic devices and chemical construction of organic materials are reviewed. The advanta- ges and disadvantages are also analyzed. Then the problems of low refractive index and low viscosity are concluded.How to solve the problems may be the focus of future research.
基金
广东省省部产学研项目(2011B090300028)
关键词
有机硅
封装材料
LED封装
organic silicon, packaging material, LED packaging
