金刚石薄膜热导率的研究现状(英文)

Research Status of Thermal Conductivity of Diamond Films

分析了金刚石薄膜热导率的声子导热机理,从金刚石薄膜晶体结构的角度总结了影响热导率的因素,例如晶界、晶内杂质、缺陷、晶粒尺寸、晶粒取向、同位素;从金刚石薄膜合成工艺角度探讨了影响金刚石薄膜热导率的因素,例如基底材料及预处理、合成温度、气源及添加气体(氧气、氮气)、工作压强、功率等。

The theory of heat conduction is analyzed using phonon heat conduction mechanism. From the view- point of multi-grain structure, the factors affecting thermal conductivity of diamond, such as grain boundary, crystal impurity, defect, grain size, grain orientation and isotope, are discussed. The deposition parameters which have effects on thermal conductivity of diamond film, such as substrate materials and pre-treatment, reaction temperature, gas-sources and other additive gases （such as oxygen or nitrogen）, pressure and power, are also analyzed.