期刊文献+

水射流辅助激光刻蚀Al_2O_3陶瓷的试验研究 被引量:8

Experimental Investigation of Water Jet-Assisted Laser Etching on Al_2O_3 Ceramics
下载PDF
导出
摘要 设计了一套用于实验的水射流辅助激光刻蚀加工装置,将激光和介质射流冲蚀加工相结合,研究激光加工参数和射流加工参数对试样材料激光复合刻蚀量和截面质量的影响。实验结果表明,激光工艺参数和射流加工参数对工件加工表面的质量优劣有着决定性的影响;该复合加工工艺可以清除加工时产生的90%以上熔渣,能有效地降低材料表面粗糙度,使得加工出的盲孔成为较为规则的倒三角(▽)形。 An experimental device of water jet--assisted laser etching was designed, laser etching technology was combined with a medium--jet erosion processing,and the influences of laser process- ing parameters and jet processing parameters on the etching capacity and cross section quality of mate- rial sample were studied. The results show that the laser processing parameters and jet processing pa- rameters have a decisive impact on the quality of the workpiece, the compound processing technology can remove above 90% melting slags which are produced by the laser processing, and the surface roughness are reduced effectively. The blind holes of the machined materials have a regular inverted triangle shape.
出处 《中国机械工程》 EI CAS CSCD 北大核心 2013年第12期1568-1571,共4页 China Mechanical Engineering
基金 国家自然科学基金资助项目(51175229) 安徽省高校自然科学省级重点项目(KJ2011A062)
关键词 激光加工 射流加工 复合加工 激光刻蚀 laser processing jet machining combined machining laser etching
  • 相关文献

参考文献8

二级参考文献19

  • 1von奥尔曼M.激光束与材料相互作用的物理原理及应用[M].北京:科学出版社,1994.7.
  • 2Sibailly O, Wagner F, Richerzhagen B. Laser micro- machining in microelectronic industry by water jet guided laser[J]. SPIE, 2004, 5339: 258-264.
  • 3Ogawa P, Perrottet D, Wagner F, et al. Chipping-free dicing of III/V semiconductor materials with the water jet guided laser [ EB/OL ] .http://www.synova.ch/pdf! 2004_LPM_GaAs. pdf, 2004 - 06 - 09.
  • 4Dushkina N, Richerzhagen B. Dicing of GaAs wafers with Synova Laser Microjet [ EB/OL ] . http://www. synova. ch/ pdf/2002.Icaleo_Dicing_GaAs. pdf. 2002 - 06 - 09.
  • 5Liang W M. Thin Wafer Dicing Issues and New Technology Cost of Ownership[J]. Future Fab International, 2005, (19): 146-153.
  • 6工研院资金中心.Electronic Trend Publication砷化镓之市场占有率[R].ITIS计划整理,2004.
  • 7Dushkina N M, Richerzhagen B. Dicing of gallium arsenide (GaAs) wafers with the laser microJet[J]. Technical Papers of ISA, 2003, 438:175 - 183.
  • 8Mai T A, Richerzhagen B. Laser-microject dicing of thin compound wafers and low-k wafers [ J] . Future Fab International, 2005, (19): 189-195.
  • 9Perrottet Delphine, Buchilly J M, Richerzhaoen B. Water- jet-guided laser achieves highest die fracture strength[J]. Future Fab International, 2005, (18): 323- 328.
  • 10Tsai C H, Chen Hongwen. Laser Milling of Cavity in Ceramic Substrate by Fracture-machining Element Technique[J]. Journal of Materials Processing Technology, 2003,136 (1/2/3) : 158-165.

共引文献30

同被引文献59

  • 1陈燕,葛恩德,傅玉灿,苏宏华,徐九华.碳纤维增强树脂基复合材料制孔技术研究现状与展望[J].复合材料学报,2015,32(2):301-316. 被引量:134
  • 2于海娟,李港,陈檬,张丙元.飞秒激光加工过程中光学参数对加工的影响[J].激光技术,2005,29(3):304-307. 被引量:12
  • 3刘敬明,曹凤国.激光复合加工技术的应用及发展趋势[J].电加工与模具,2006(4):5-9. 被引量:5
  • 4WEBB,MA B W.Single-phase liquid jet impingement heat transfer[J]. Adv. Heat Transfer,1995(26): 105-217.
  • 5黄春峰.先进硬脆性材料复合加工技术的发展: 大型飞机关键技术高层论坛暨中国航空学会[C].深圳: [出版者不详], 2007.
  • 6J ZHIXIN, Z JIANHUA, A XING.Study on a new kind of combined machining technology of ultrasonic machining and electrical discharge machining [J].International Journal of Machine Tools and Manufacture, 1997, 37(2): 193-199.
  • 7李春奇, 杨立军, 王扬.水导激光加工技术现状分析[J/OL].[2011-11-17].http://www.docin.com.
  • 8RICHERZHAGEN B, HOUSH R, WAGNER F, et al.Water jet guided laser cutting: a powerful hybrid technology for fine cutting and grooving[J].Progress in Theoretical Chemistry and Physics, chapter, 2004, 5.
  • 9SAMANT A N, DAHOTRE N B.Differences in physical phenomena governing laser machining of structural ceramics[J].Ceramics International, 2009, 35(5): 2093-209.
  • 10DUBEY A K, YADAVA V.Laser beam machining-a review[J].International Journal of Machine Tools and Manufacture, 2008, 48(6): 609-628.

引证文献8

二级引证文献31

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部