电子微连接高温无铅钎料的研究进展

Development of high-temperature lead-free solder in electronic micro-connection

基于环保的压力和人类健康的需求,电子产品微连接材料采用无铅钎料代替传统含铅钎料已是必然趋势。总结了新型无铅高温钎料的基本要求,重点评述了Bi基合金、Au基合金、Zn基合金和Sn-Sb基合金等几类钎料国内外研究现状,指出通过多元合金相图计算、合金化、材料复合化的方式开发成本、工艺性能均能与含铅钎料相媲美的无铅高温钎料。

Based on the requirement of environmental protection and human health, lead-free solder used elec- tronic products instead of the traditional leaded solder was inevitable trend. This paper summarized the basic re quirements of new high-temperature lead-free solder. Several kind of solder research status at home and abroad about Bi alloy, Au alloy, Zn alloy and Sn-Sb alloy and so on, were reviewed. Developing high-temperature lead- free solder with cost and performance comparable to lead solder by the way of the multi component phase dia gram calculation, alloying and composite method.