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工艺条件对电镀锌锡镍镀层的影响 被引量:1

Influence of process conditions on electroplating zinc-tin-nickel ternary alloy
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摘要 采用焦磷酸盐体系在电解铜箔上电镀锌锡镍三元合金。研究了电流密度、温度和pH值对镀层质量的影响,确定了在电解铜箔上电镀锌锡镍三元合金的较佳的工艺条件。采用能谱仪分析了镀层的组成,测试结果表明,镀层中锌含量为34.00(wt)%,镍含量为11.08(wt)%,锡含量为54.92(wt)%。该工艺适合工业化应用。 Electrodeposition of zinc-tin-nickel ternary alloy on the surface of copper foil from pyrophosphate system was investigated. Effect of current density, temperature, pH on the appearances of planting were discussed respectively. Process conditions for electroplating zinctin-nickel ternary alloy on the surface of copper foil have been optimized. The composition of electrodeposit was tested by energy dispersive spectrometer. The testing results shows that zinc of 34.00(wt)%, nickel of 11.08(wt)% and tin of 54.92(wt)% in plating layer. The process is suitable for industrial application
作者 周玉梅
出处 《化学工程师》 CAS 2013年第6期72-73,共2页 Chemical Engineer
关键词 电解铜箔 锌锡镍 电镀 表面处理 electrolytic copper foil ZnSnNi electrodeposition surface treatment
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  • 1王阿红.应用于HDI/BUM技术领域的超薄铜箔[J].印制电路信息,2005,13(3):29-34. 被引量:5
  • 2祝大同.印制电路用电解铜箔新时期的发展与思考.科技日报,2002,9,6.
  • 3刘生鹏,茹敬宏.印制电路板用铜箔的现状及发展趋势.第八届覆铜板市场技术研讨会文集.
  • 4Yamanishi Keisuke( Hitachi JP) ,Oshima Hide( Hitachi JP)and Saknguehi Kazuhiko ( Hitachi JP), Copper foil for printed circuits and process for producing the same,US Patent 5366814.
  • 5Martin Sylvia ( Shelby Township, MI ) , Alkoxylated dimercaptans as copper addtitves and de - polarizing additives, US Patent 5730854.
  • 6Endo Yasuhiro ( Shimodate, JP), Ham Hirokit ( Yamanashi, JP ) and Yagiheai Nobuehika( Shimodate, JP), Method of producing copper foil for fine wiring, US patent 6495022.
  • 7Paul C. Wynn,Craig V. Bishop, Replacing Hexavalent Chromium in Passivations on Zinc Plated Parts.
  • 8Peter Hulser,Replacement of Hexavalent Chrome Passivation on Galvanized Steel, Germany.
  • 9张福林,电镀与环保,1985年,5卷,1期,37页
  • 10石井英雄,日本电镀指南,1984年

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