KDP晶体金刚石线锯切入方向的研究

Study on Wire Approach Direction Using Diamond Wire Saw Cutting KDP Crystal

KDP晶体具有强烈的各向异性,为了使锯切时锯丝的偏移量较小,获得好的切片表面质量,本文对金刚石线锯切入方向进行了研究。锯丝两边材料去除率差异性的变化是导致锯丝偏移量变化的重要因素,因此本文基于保持锯切时锯丝两边材料去除率差异性最小的原则,分析得出:锯切(001)晶面时,锯丝切入方向的改变不影响锯丝偏移量的大小,锯切二倍频晶面时选择[110]、[-1-10]晶向、锯切三倍频晶面时选择[100]、[-100]晶向,此时锯丝两边材料去除率差异性最小。该线锯切入方向的提出对于KDP晶体的线锯切片技术的研究具有重要的意义。

KDP crystal has strongly anisotropic, to minimum the saw wire offset; improve the KDP slice quality, this paper study on wire approach direction. The saw wire on both sides of the material removal rate differences change is the important factor leading to offset changes, so this paper based on maintaining the minimum principle of the material removal rate differences on both sides of the wire. Analytical results that any wire approach orientation can be chosen for slicing the （001） plane wire approach orientation of change does not affect the saw wire offset, for the doubler plane there are two orientations [ 110 ], [ -1-10 ] and for the triplor plane there are two orientations [ 100 ], [ 00 ]. This study has very important significance to research KDP crystal wire saw slicing.