线锯切技术发展状况

State-of-the-arts of wire sawing technology

回顾线锯切技术发展的历史背景。分析了在半导体工业中锯切硅晶锭使用的超薄金刚石内圆锯片的优缺点。阐述游离磨料线锯的产生及其与超薄金刚石内圆锯片的性能对比以及游离磨料线锯在使用中的局限性。文章还介绍了固结磨料线锯中磨料的一些固结方式,并详细阐述当前先进的树脂粘结金刚石线锯和电镀金刚石线锯以及浸渍金刚石线锯的技术规格和技术性能。

Historical background of wire sawing technology development was reviewd. Advantages and disadvantages of ulrta-thin diamond annular sawblade used for cutting silicon ingots in semiconductor industry were analysed. The emergence of loose abrasive wire saw and the performance comparison between it and ultra-thin diamond annular saw- blade, along with its limitation in applications were described. As for the fixed abrasive wire saw some fixation methods of the abrasive particles were introduced in this paper, and the technical performance and technical specifications of the advanced resinoid dia- mond wire saw, electroplated diamond wire saw and diamond-impregnated wire saw were also described in detail.