摘要
首先叙述了防静电包装与防静电包装材料的概念,对微电子产品的防静电包装设计进行了介绍,并分别讨论了不同种类的抗静电包装材料的特点,简述了微电子产品包装国内外的发展情况,最后指出了微电子产品防静电包装的发展趋势与良好的市场前景。
The concept of anti-static packaging and anti-static packaging material were first described. Anti-static packaging design for microelectronic products was introduced. The characteristics of different types of anti-static packa- ging material were discussed. Development status of anti-static packaging for microelectronic products at home and a- broad was introduced. Development trend and market prospects of anti-static packaging for microelectronic products were put forward.
出处
《包装工程》
CAS
CSCD
北大核心
2013年第13期117-122,共6页
Packaging Engineering
基金
山东理工大学重大横向课题(9002-109701)
关键词
微电子产品
防静电设计
包装材料
抗静电剂
microelectronic products
anti-static design
packaging material
anti-static agent
