基于超声扫描显微镜的金属封装检测研究

Research on the Metal Package the Scanning Acoustic Microscope

基于超声扫描显微镜,对金属封装的声学特性进行分析,结果表明,超声扫描显微镜可实现对金属封装焊缝缺陷的定性、定位、定量检测。

This paper invents the Metal Package on the foundation of echo scanning based on the Scanning Acoustic Microscope. It shows that the Scanning Acoustic Microscope. Can not only identifies and locates the defect, but also precisely measures the defect size.