摘要
本文主要从半导体封装的接线排布方式出发,介绍了几种主要的封装形式,以便我们更好的了解半导体封装的发展历程。
This article mainly from the semiconductor package wiring arrangement way, introduced several important packages, so that we can better understand the development process of semiconductor package.
出处
《变频技术应用》
2013年第3期53-57,共5页
INVERTER TECHNOLOGIES AND APPLICATIONS