摘要
BGA(ball grid array)球栅阵列封装技术是20世纪90年代以后发展起来的一种先进的高性能封装技术,是一种用于多引脚器件与电路的封装技术。BGA最大的特点就是采用焊球作为引脚,这不仅提高了封装密度,也提高了封装性能。而植球工艺作为BGA封装中的关键工艺将会直接影响器件与电路的性能及可靠性。影响BGA植球工艺的主要因素有:植球材料、植球工艺及回流焊工艺。文章通过对BGA植球的基板、焊膏/助焊剂、焊球等材料的详细介绍,详实阐述了植球工艺过程,并对BGA后处理的回流焊工艺进行了详细描述,提供了BGA植球工艺的检测方法,对植球工艺的可靠性进行了探讨。
The BGA technology is an advanced performance packaging process,and is used to package device which has a lot of pins.The projecting feature of BGA is to use soldered ball as pins,this not only advanced packaging density, also advanced performance.The soldered ball process which is the key to BGA will effect the performance and reliability of the device.The main factors of effecting BGA＇s soldered ball process have： the material of soldered ball, the process of soldered ball and solder-reflow.This paper expounds the detail process of soldering ball and solder-reflow,peovides the test method,discusses the reliability of the process of soldering ball based on introducing baseplate, solder paste, soldered ball etc of the BGA technology.
出处
《电子与封装》
2013年第6期1-6,37,共7页
Electronics & Packaging
关键词
BGA
植球
回流焊
BGA
soldering ball
solder-reflow
