LED封装用玻璃/Al_2O_3系LTCC基板材料的性能

Properties of glass/Al_2O_3 system LTCC substrate materials for LED packaging

以硼硅玻璃和Al2O3陶瓷粉料为原料,通过改变玻璃和Al2O3质量比(60∶40～40∶60),采用低温烧结法制备低温共烧多层陶瓷基板(LTCC)材料。采用热膨胀仪、电子万能试验机、导热仪、X线衍射仪(XRD)、扫描电子显微镜(SEM)和阻抗分析仪表征样品的性能。结果表明:样品在烧成温度超过650℃以后,开始出现快速的收缩。随着Al2O3含量增加,样品的密度先增加后减小,烧结收缩率减小。随着样品密度下降,样品的热导率(λ)、抗弯强度(σ)和介电常数(εr)降低,介电损耗(tanδ)恶化。当Al2O3质量分数为45%时,复相材料于875℃烧结致密,显示出较好的性能,λ=2.89 W/(m.K),σ=203.1 MPa,εr=7.66,tanδ=9.1×10-4(于10 MHz下测试)。

Low temperature co-fired ceramic （LTCC） materials were prepared with borosilicate glass and A12 03 ceramic powder at different mass ratios （ m （glass） ： m （ A12 03 ） = 60： 40-40：60 ） using low-tempera- ture sintering method. The performance of samples were investigated by thermal expansion machine, electronic universal tensile testing machine, thermal conductivity instrument, X-ray diffraction （ XRD ）, scanning electron microscope（ SEM）, and impedance analyzer. The results showed that the rapid shrinkage of the samples appeared from 650 ℃, and the density of samples increased with the increase of A12 O3 content at first, then it decreased. With the decrease of the density of the composites, corresponding decrease was found in thermal conductivity （ A ）, bending strength （σ） and dielectric constant （ σ ） of the LTCC materials while its dielectric loss （tan δ） got worse. The glass/A12O3 composites with 45% A12 O3 sintered at 875 ℃ exhibited better properties ： λ = 2. 89 W/（ m·K）, σ = 203.1 MPa, εr = 7.66, tan δ = 9.1 × 10 ^-4 （at 10 MHz）.