航天器单机内PCB焊点低气压放电试验研究

Low-pressure discharging test for solder fillets on PCBs used in spacecraft units

在轨航天器单机内部存在低气压放电风险,因此对于工作电压等级较高的PCB,需要采用放电防护工艺和措施。文章针对几种现有的放电防护工艺,试验测量了不同工艺条件下的焊点起晕电压。试验结果表明,球形焊点的起晕电压高于正常焊点;焊点之间是否开槽对起晕电压无明显影响;涂三防漆的焊点起晕电压显著高于未涂漆焊电极。试验结果能够为航天器用PCB焊点放电防护工艺评估提供指导。

The risk of discharging always exists inside the unit of spacecraft.Therefore,for PCBs working in a relatively high voltage,anti-discharge techniques and measures are necessary.To evaluate some present anti-discharge technologies,the corona inception voltage（CIV） of solder fillets under different technological conditions is measured.The results show that in similar conditions,the CIV of round shape solder fillets is higher than that of the ordinary solder fillets;there is no obvious difference for solder fillets with or without gap between them;the CIV of solder fillets with functional paint is considerably higher than those without paint.The above test results may provide some guidance for anti-discharge measures for PCBs used in spacecraft.