基于多芯片组装的紧凑型UQPSK调制倍频模块

The Multiplier Module Compact UQPSK Modulation Based on Multi-chip Assembly

介绍了一种高载波隔离度的S波段UQPSK调制倍频模块的设计技术。对UQPSK调制电路的设计流程进行了阐述,对影响最终指标的关键因素进行了分析。同时,介绍了如何在简化电路、缩小体积的前提下获得良好的综合性能以及如何分配各级器件指标。最终研制出具有高性能的S波段UQPSK调制倍频模块。

This paper describes the high carrier isolation of the S band UQPSK modulation and frequency multi- plier module design technology. The UQPSK modulation circuit design process is described, and an analysis of the key factors that affect the final performance is made. The paper also covers retaining overall performance while sim- plifying the circuit and reducing the volume and the allocation of the device specification at all levels. The high per- formance S-band UQPSK modulation and multiplier module is successfully developed.