基于高温共烧陶瓷基板的三维互连技术

Three-dimensional Interconnection Technology Based on High Temperature Co-fired Ceramics Substrate

基于高温共烧陶瓷技术的多层基板是实现组件小型化、轻量化、高可靠的有效手段。文中研究了基于HTCC技术的多层基板三维立体互连结构,包括基板内垂直转换及基板间立体互连。通过仿真优化设计,实测结果表明,文中所设计的多种结构能够有效地应用于组件三维互连中。

Multi-layer substrate based on high temperature co-fired ceramics （HTCC） technology is a realistic way to realize microwave modules with miniature size, light weight and high reliability. In this paper, three-dimen- sional interconnection structures based on HTCC substrate are discussed, including vertical transition in and between the substrate. By means of simulation and optimization, the presented test results show that the structures proposed in the paper can be well used in the design of modules.