高压电脉冲技术对废弃电路板的破碎研究

Fragmentation of Waste Printed Circuit Boards by High Voltage Pulse

利用高压脉冲技术对废弃电路板进行了破碎研究,并利用X射线荧光光谱仪(XRF)对破碎产物进行了表征.结果表明,高压电脉冲技术可利用废弃电路板中金属和非金属的电学特性差异对其进行破碎,同时还能够将大部分的铜都富集在较窄的粒度范围中,实现对金属的富集,有利于后续的分选和回收.高压电脉冲能够使废弃电路板沿铜箔与基材以及铜箔与阻燃剂层之间的界面发生解离,而这种解离是从界面的边缘开始发生的,并随着脉冲个数的增加逐渐地向界面内部延伸,直至界面彻底分离.经过400脉冲作用后,铜箔与基材以及铜箔与阻燃剂层之间实现了完全分离,电路板中97.92%的铜富集于粒径<2 mm的颗粒中,而这部分颗粒仅占电路板总质量的39.71%.

In order to solve the 1iberation problems existing in the dismantling and crushing process of electronic waste,we used the high voltage pulse（HVP） to perform a series of experiments on waste printed circuit boards（WPCBs）.Taking advantage of different electrical properties between metal and non-metal materials,HVP could separate the metal from non-metal efficiently.Furthermore,the crushed products were characterized by X Ray Fluorescence Spectrometry（XRF）.The results show that the liberated copper is enriched in a narrow particle size range,facilitating the subsequent sorting and recycling processes.The liberation takes place along the interface forming between copper foil and the substrate and between copper foil and flame retardant layer.With the increase in the number of pulses,the liberation extends to the internal place at the interfaces from the edge gradually until the copper foil is dissociated from the substrate and the flame retardant completely.After 400 pulses,almost all copper foil on WPCBs was liberated from the substrate and the flame retardant.As a result,the 97.92% of copper in WPCBs was enriched in the fraction below 2 mm,but the weight of the fraction below 2 mm was only 39.71% that of WPCBs.